Carbon Nanotube Array (CNT Array)
Product Overview
TANFENG Carbon Nanotube Arrays yog ib hom kev hloov pauv ntawm cov pa roj carbon nanotubes uas ntau lab tus tib neeg nanotubes tau loj hlob nyob rau hauv ib qho kev taw qhia siab, ntsug ntsug ntawm lub substrate. Qhov kev tsim tshwj xeeb no qhib cov khoom anisotropic uas tsis tuaj yeem ua tiav nrog randomly dispersed CNT hmoov. Peb cov txheej txheem Catalytic Chemical Vapor Deposition (CCVD) tso cai rau kev tswj xyuas meej ntawm cov array qhov ntom, qhov siab, thiab nanotube zoo, ua rau nws yog ib qho zoo tagnrho lub tsev thaiv rau tom ntej - tiam electronics, thermal tswj systems, thiab advanced sensors.
1. Cov ntaub ntawv tseem ceeb ntawm cov khoom
Yam khoom:Qhov ntom ntom ntom ntom ntom hav zoov ntawm cov pa roj carbon nanotubes loj hlob ntawm ntau yam substrates (Silicon, Quartz, Hlau Foils, thiab lwm yam).
Yam Tseem Ceeb: Ntau-Walled Carbon Nanotube Arrays (MWCNT Arrays), nrog rau kev xaiv tshwj xeeb rau ob peb-Walled thiab Ib Leeg-Walled Arrays.
Standard Substrate Loj:Customizable los ntawm 1cm x 1cm mus rau 6-nti wafers. Ntau hom ntawv muaj nyob rau ntawm qhov kev thov.
Feature tseem ceeb: Anisotropic zog - cov khoom sib txawv ntawm cov axis ntawm kev sib raug zoo piv rau perpendicular rau nws.
2. Core Performance Parameters
Array Qhov siab:10 µm txog 2,000 µm (customizable nrog ± 5% kam rau ua).
Areal ntom ntom:10⁹ txog 10¹¹ tubes / cm² (tswj tau kom haum rau cov neeg kho tshuab ua raws thiab thaj chaw saum npoo av).
CNT Txoj kab uas hla:5 nm txog 50 nm (rau MWCNTs), nrog txoj kab uas hla nqaim.
Purity:> 99% Carbon Purity (Catalyst residue <1%).
Thermal stability:ruaj khov nyob rau hauv huab cua mus txog 450 degree; nyob rau hauv inert cua mus txog 2800 degree.
3. Cov Khoom Hluav Taws Xob (Ntau & Nto Resistivity)
Cov qauv sib xyaw ua ke muab tshwj xeeb kev taw qhia hluav taws xob conductivity.
Volume Resistivity (Los ntawm -Plane):Raws li qis10⁻³ Ω·cmraws nanotube axis. Qhov kev tiv thaiv qis no yog qhov zoo rau cov ntawv thov uas xav tau tam sim no ntsug, xws li hauv los ntawm - silicon vias (TSVs) lossis roj teeb electrodes.
Surface Resistivity (Tshooj Resistance):Yuav tau engineered los ntawm< 10 Ω/sq to > 10⁶ Ω/sq, nyob ntawm qhov ntom ntom, qhov siab, thiab tom qab- kho kev loj hlob. Qhov no ua rau nws tsim nyog rau kev tsim pob tshab conductive electrodes nrog siab yooj.
4. Dispersibility & tuav
Hauv -Situ Siv: Cov arrays yog tsim los rau kev siv ncaj qha rau ntawm txoj kev loj hlob substrate, tshem tawm qhov xav tau rau re-dispersion thiab khaws cia cov pristine aligned qauv.
Qhuav-Hloov tau: Cov arrays tuaj yeem qhuav tau yooj yim -hloov mus rau lwm lub hom phiaj substrates (xws li, polymers, hlau, iav) siv cov txheej txheem stamping, ua kom muaj kev sib koom ua ke rau hauv cov khoom siv tau yooj yim thiab hybrid.
Kev daws teeb meem (Optional):Raws li kev thov, arrays tuaj yeem raug sheared thiab ua tiav rau hauv cov ntsiab lus siab, isotropic CNT slurries nrog zoo heev dispersibility rau txheej daim ntaub ntawv.
5. Lub cev muaj zog
Mechanical Strength: Cov qauv sib xyaw ua ke nthuav tawm lub siab elastic modulus ntawm> 1 TPa (theoretical) thiab tshwj xeeb compressive lub zog, ua haujlwm zoo li lub caij nplooj ntoos hlav tsis muaj zog -zoo li cov khoom siv.
Compression rov qab:Arrays tuaj yeem compressed rau ntau tshaj 80% strain thiab rov qab elastically, ua rau lawv zoo heev rau kev siv compressible conductive interconnects lossis shock absorbers.
Ib cheeb tsam tshwj xeeb: 200 - 800 m² / g (nyob ntawm txoj kab uas hla ntawm lub raj thiab array sib nrug), muab qhov chaw loj heev rau kev cuam tshuam thiab adsorption.
6. Daim ntawv thov Scenarios & Kev lag luam
Thermal Interface Materials (TIMs): Exploiting the ultra-high thermal conductivity (>1000 W / mK rau ib lub raj) raws li axis los tsim siab -kev ua haujlwm thermal pads rau CPU / GPU txias.
Field Emission Devices: Siv cov lus qhia ntse ntawm cov nanotubes ua kom ruaj khov, qis -voltage electron emission hauv X-ray tubes, displays, thiab microwave amplifiers.
Advanced Sensors:Qhov chaw siab saum npoo thiab anisotropic hluav taws xob teb ua rau lawv zoo tagnrho rau cov pa roj, tshuaj lom neeg, thiab roj ntsha sensors.
Zog Cia: Siv ua 3D scaffolds rau lithium - ion roj teeb anodes thiab supercapacitor electrodes, ua kom yooj yim rau kev thauj mus los sai thiab them nqi siab.
Microelectronics: Raws li cov khoom siv sib cuam tshuam tshiab rau los ntawm -silicon vias (TSVs) kom txo RC qeeb hauv 3D kev sib xyaw ua ke.
7. Txoj Kev Taw Qhia
Cov txheej txheem kev loj hlob yog ua raws li cov txheej txheem CCVD ua tib zoo. Ib zaj duab xis nyias ntawm catalyst (piv txwv li, Fe, Co) yog tso rau ntawm lub substrate. Ntawm qhov kub siab (600-900 degree) hauv cov pa roj carbon- muaj cov pa cua (piv txwv li, C₂H₄), cov catalyst nanoparticles decompose cov pa roj, thiab carbon atoms yaj thiab precipitate tawm, tsim nanotubes. Cov "neeg coob coob" thiab van der Waals rog ntawm cov tub nyob sib ze yuam kom lawv loj hlob nyob rau hauv tus kheej - taw qhia, ntsug dlhos, tsim ib tug tuab, zoo li hav zoov.
8. Kev Tswj Xyuas Zoo & Kev Ntsuas Cov Ntaub Ntawv
Morphology Control:SEM imaging lees paub qhov sib npaug ntawm qhov sib npaug, qhov siab, thiab qhov ntom ntom rau txhua pawg.
Structure Integrity:Raman Spectroscopy (G / D band ratio> 10) lees paub cov graphitic zoo thiab qhov tsis xws luag.
Hluav taws xob validation: Hauv -lub tsev 4-point sojntsuam kuaj xyuas daim ntawv tsis kam thiab cov nqi tiv thaiv, nrog cov ntaub ntawv muab hauv Daim Ntawv Pov Thawj Kev Ntsuam Xyuas (CoA).
Batch Consistency:Kev Tswj Xyuas Txheej Txheem Txheej Txheem (SPC) yog siv los xyuas kom meej qhov sib txawv me me ntawm qhov tseem ceeb (qhov siab, tsis kam) hla lub wafer thiab los ntawm batch mus rau batch.
9. Ntim
Txhawm rau tiv thaiv qhov muag me me, ua raws cov qauv thaum thauj khoom thiab khaws cia:
Ntim Ntim: Substrates nrog CNT arrays ruaj ntseg mounted nyob rau hauv antistatic, siab -precision wafer nqa los yog kev cai-tsim nqus tsev vacuum- kaw tais.
Secondary Ntim: Muab tso rau hauv lub kaw lus, tiv thaiv -cov av noo aluminium hnab nrog desiccant.
Tertiary Ntim:Shipped nyob rau hauv kev txhawb zog, poob siab -absorbent thawv los tiv thaiv kev puas tsuaj.
10. Lub tuam txhab muaj zog
TANFENG yog tus thawj coj thoob ntiaj teb lees paub hauv kev sib txuas ntawm cov pa roj carbon nanostructures siab heev. Peb lub xeev- ntawm--Art Class 100 cleanroom cov chaw hauv tsev kev cai- ua, loj- cheeb tsam CNT array loj hlob reactors. Nrog rau ib pab neeg mob siab rau PhD-theem kws tshawb fawb thiab engineers, peb tau pioneered lub teev-nce ntawm siab- zoo aligned CNT arrays los ntawm lab xav paub mus rau cov khoom lag luam. Peb tuav ntau patents ntawm catalyst tsim thiab cov txheej txheem loj hlob, ua rau peb xa cov khoom tsis sib xws thiab kev hloov kho kom tau raws li qhov xav tau ntawm daim ntawv thov. Peb qhov kev cog lus rau R & D ua kom ntseeg tau tias peb nyob twj ywm ntawm lub hauv ntej ntawm CNT array technology.
Cim npe nrov: Tuam Tshoj cnt array manufacturers, lwm tus neeg, Hoobkas
